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GaAs MMIC
GN04022N
GaAs N-Channel IC
For W-CDMA For high-frequency and high-power SPDT switch Features
* Low insertion * High isolation * S-Mini type 6-pin package
1 2 3 (0.65) (0.65) 1.30.1 2.00.1 10
(0.425)
Unit: mm
0.12+0.05 -0.02
0.20.05 6 5 4
1.250.10 2.10.1
Absolute Maximum Ratings Ta = 25C
Parameter Supply voltage Control current Maximum input power Operating ambient temperature Storage temperature Symbol VDD Vctrl(H)-Vctrl(L) PIN Topr Tstg Rating 8 +6 35 -30 to +90 -40 to +120 Unit V
dBm C C
Marking Symbol: LV
Electrical Characteristics Vctrl(L) = 0 V, Vctrl(H) = 3.0 V, f = 1 920 MHz to 2 170 MHz, Ta = 25C 3C
Parameter Insertion loss Symbol IL Conditions In-Out1, PIN = 26 dBm In-Out2, PIN = 26 dBm Isolation Voltage standing wave ratio * Input 0.1 dB Compression Input 1 dB Compression * Control current Note) *: Designed specification ISO In-Out1 (In-Out2 on) In-Out2 (In-Out1 on) VSWR PIN(P0.1 dB) PIN(P1.0 dB) Ictrl In-Out1, 2 Vctrl(H) = 3 V Vctrl(H) = 3 V In-Out1, 2 30 32 21 21 Min Typ 0.25 0.25 23 23 1.10 31 33 1 9 1.30 dB dBm dBm A Max 0.45 0.45 dB Unit dB
Publication date: 23 Jine, 2003
SGB00019AED
0 to 0.1
V
1: Vctrl1 2: In 3: Vctrl2 4: Out2 5: GND 6: Out1 EIAJ: SC-88A SMini6-G1 Package
0.90.1
0.9+0.2 -0.1
0.20.1
5
1
GN04022N
Measurement Circuit
Out1 Out2
GaAs MMIC
51 pF
6 5 4 3
51 pF
1
Vctrl1
2
1 000 pF
51 pF
In
Vctrl2
1 000 pF
POUT , IM3 PIN
Maximum output power POUT, Inter modulation IM3 (dBm)
100 80 60 40 20 0 -20 -40 -60 -80 -100 0 10 20 30 40 50 60 70 80 90 100 IM3 POUT f1 = 1 960 MHz f2 = 1 980 MHz fIM3 = 2 000 MHz VCTL = 0 V / 3 V
Maximum input power PIN (dBm)
2
SGB00019AED
Caution for Safety
This product contains Gallium Arsenide (GaAs).
DANGER
GaAs powder and vapor are hazardous to human health if inhaled or ingested. Do not burn, destroy, cut, cleave off, or chemically dissolve the product. Follow related laws and ordinances for disposal. The product should be excluded form general industrial waste or household garbage.
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL

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